Call for Papers IEEE International Conference on Multimedia and Expo (ICME) 2019 With around 1,000 submissions and 500 participants each year, the IEEE International Conference on Multimedia & Expo (ICME) has been the flagship multimedia conference sponsored by four IEEE societies since 2000. It serves as a forum to promote the exchange of the latest advances in multimedia technologies, systems, and applications from both the research and development perspectives of the circuits and systems, communications, computer, and signal processing communities. In 2019, an Exposition of multimedia products, prototypes and animations will be held in conjunction with the conference. Authors are invited to submit a full paper (two-column format, 6 pages maximum) according to the guidelines available on the conference website at (http://www.icme2019.org). All papers will undergo the double-blind review process. Only electronic submissions will be accepted. Topics of interest include, but are not limited to: Artificial Intelligence for multimedia Multimedia for healthcare and society Multimedia and vision Multimedia and language Multimedia and new sensor signal processing Multimedia analytics, search and recommendation Social and cloud-based multimedia 3D multimedia and AR/VR Multimedia quality assessment and metrics Multi-modal media computing and human-machine interaction Multimedia communications, networking and mobility Multimedia security, privacy and forensics Multimedia software, hardware and application systems Multimedia standards, trends and related issues ICME 2019 will showcase high quality oral and poster presentations and demonstration sessions. It will also feature IEEE societies sponsored Workshops. We welcome researchers, developers and practitioners to organize workshops, tutorials, special sessions, technical demos, grand challenges, and industrial exhibitions, and so on, on various new emerging topics. The conference plans to select and recognize one diamond and several platinum paper awards. A number of other awards sponsored by industry and institutions will also be offered. Accepted papers have to be registered and presented; otherwise, they will not be included in the IEEE Xplore Library. Panel/Tutorial/Special Session/Grand Challenge Proposals Due: October 1, 2018 Notification of Grand Challenge Proposals: October 15, 2018 Workshop/Demo/Industry Proposals Due: October 15, 2018 Notification of Panel/Tutorial/Special Session Proposals: October 22, 2018 Notification of Workshop/Demo/Industry Proposals: November 12, 2018 Regular Paper Submission: December 17, 2018 Notification of Regular Paper Acceptance: March 11, 2019 Workshop/Industry Papers Submission: April 01, 2019 Demo Papers Submission: April 07, 2019 Camera-Ready Regular Paper Due: April 15, 2019 Grand Challenge (GC) Paper/Model Submission: April 08, 2019 Notification of Workshop/Demo/Industry/GC Papers Acceptance: April 22, 2019 Camera-Ready Workshop/Demo/Industry/GC Papers Due: May 06, 2019 General Chairs Feng Wu U of Science and Tech of China, China Lina J. Karam Arizona State University, USA Tao Mei JD AI Research, China Program Chairs Jun Wu Tongji University, China Marta Mrak BBC R&D, UK Honggang Wang University of Massachusetts Dartmouth, USA Roger Zimmermann National University of Singapore, Singapore Zhu Li Univ of Missouri, Kansas city, USA Lei Zhang Microsoft, USA Panel Chairs Chang Wen Chen CUHKSZ, China / SUNY-Buffalo, USA Fernando Pereira Instituto Superior T¨¦cnico, Portugal Chia-Wen Lin National Tsing Hua University, Taiwan Award Chairs Yonggang Wen Nanyang Technological University, Mei-Ling Shyu University of Miami, USA Tutorial Chairs Jiebo Luo University of Rochester, USA Zheng-Jun Zha U of Science and Tech of China, China Workshop Chairs Jingdong Wang Microsoft Research Asia, China Susanne Boll University of Oldenburg, Germany Z. Jane Wang University of British Columbia, Canada Special Session Chairs Enrico Magli Politecnico di Torino, Italy Junwei Han Northwestern Polytechnical U, China Grand Challenge Chairs Gene Cheung York University, Canada Jiaying Liu Peking University, China Industrial Program Chairs Liang Lin Sun Yat-Sen University, China Chonggang Wang InterDigital, USA Xiaoqing Zhu Cisco, USA Student Program Chairs Xiaoyan Sun Microsoft Research Asia, China Shaoen Wu Ball State University, USA Weiyao Lin Shanghai Jiao Tong University, China Poster/Demo Chairs Dong Tian InterDigital, USA Cong Shen U of Science and Tech of China, China Yu-Gang Jiang Fudan University, China Web Chairs Dalei Wu University of Tennessee, USA Wu Liu JD AI Research, China Local/Event Chairs Chong Luo Microsoft Research Asia, China Hanli Wang Tongji University, China Dan Zeng Shanghai University, China Sponsorship Chairs Le Dong U of Electr Science and Tech of China, China Yongdong Zhang U of Science and Tech of China, China Junsong Yuan State U of New York at Buffalo, USA Finance Chairs Chengcui Zhang U of Alabama at Birmingham, USA Dongdong Zhang Tongji University, China Registration Chairs Haoqi Ren Tongji University, China Dong Liu U of Science and Tech of China, China Liquan Shen Shanghai University, China Publication Chairs Rui Wang Tongji University, China Jian Zhang University of Technology Sydney, Australia Qi Tian University of Texas at San Antonio, USA Publicity Chairs Shui Yu University of Technology Sydney, Australia Richang Hong Hefei University of Technology, China Shiwen Mao Auburn University, USA Wen-Huang Cheng National Chiao Tung University, Taiwan